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Mold-Tek Packaging informs about board meeting

08 Apr 2023 Evaluate

Mold-Tek Packaging has informed that the meeting of the Board of Directors of the Company is scheduled on 12/04/2023 ,inter alia, to consider and approve inter-alia, a proposal for declaration of Interim Equity Dividend, if any, for the Financial Year 2022-23.

The above information is a part of company’s filings submitted to BSE.