Bondada Engineering has received a Letter of Award (LoA) from South Central Railways for providing ground infrastructure works for provision of Kavach and 4G Lte-R high density network and pile foundation for towers in South Central Railways. The said order is to be executed within 720 days from the appointed date. The size of order is Rs 228.17 crore.
Bondada Engineering is engaged in the business of providing engineering, procurement and construction (EPC) services and operations and maintenance (O&M) services to its pan India customers operating in telecom and solar energy industry.
| Company Name | CMP |
|---|---|
| Vindhya Telelinks | 1376.60 |
| HFCL | 95.45 |
| Pace Digitek | 177.15 |
| Bondada Engineering | 359.85 |
| GTL Infrastructure | 1.26 |
| View more.. | |
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