Paras Defence and Space Technologies has incorporated a subsidiary in the name of ‘Paras Semiconductors’ on February 27, 2026. The subsidiary has been incorporated to set up state-of-the-art advanced heterogeneous packaging and 3D Packaging OSAT (Outsourced Semiconductor Assembly and Testing), with a focus on AI, High-Performance Computing (HPC), Networking, and Data Center Applications. The company holds 70% of equity shares in the subsidiary.
Paras Defence and Space Technologies is primarily engaged in the designing, developing, manufacturing, and testing of a variety of defence and space engineering products and solutions.
