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Mold-Tek Packaging board to consider Interim Dividend

08 May 2014 Evaluate

Mold-Tek Packaging has informed that a meeting of the Board of Directors of the Company will be held on May 14, 2014, to consider Declaration of Interim Dividend for the Financial Year 2013-14.

The above information is a part of company’s filings submitted to BSE.

Peers
Company Name CMP
Uflex 568.65
EPL 216.50
AGI Greenpac 641.70
Huhtamaki India 207.30
TCPL Packaging 4403.95
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