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Mold-Tek Packaging fixes Record Date for Interim Dividend

08 May 2014 Evaluate

Mold-Tek Packaging has informed that the Company has fixed May 21, 2014 as the Record Date for the purpose of payment of Interim Dividend, if declared by the Board.

The above information is a part of company’s filings submitted to BSE.

Peers
Company Name CMP
Uflex 568.65
EPL 216.50
AGI Greenpac 641.70
Huhtamaki India 207.30
TCPL Packaging 4403.95
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