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Mold-Tek Packaging informs about EGM

01 Dec 2014 Evaluate

Mold-Tek Packaging has informed that the Extra Ordinary General Meeting (EGM) of the Company will be held on December 24, 2014.

The above information is a part of company’s filings submitted to BSE.

Peers
Company Name CMP
Uflex 568.65
EPL 216.50
AGI Greenpac 641.70
Huhtamaki India 207.30
TCPL Packaging 4403.95
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