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Mold-Tek Packaging fixes record date for interim dividend

06 Feb 2012 Evaluate

Mold-Tek Packaging has informed that the record date for the purpose of interim dividend, if declared shall be February 22, 2012.

The above information is part of company’s filing submitted to the BSE.   

Peers
Company Name CMP
Uflex 568.65
EPL 216.50
AGI Greenpac 641.70
Huhtamaki India 207.30
TCPL Packaging 4403.95
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