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Mold-Tek Packaging to consider Final Dividend

19 May 2015 Evaluate

Mold-Tek Packaging has informed that a meeting of the Board of Directors of the Company will be held on May 19, 2015, to transact and to recommend final dividend for the Financial Year 2014-15, subject to approval of Shareholders in Annual General Meeting.

The above information is a part of company’s filings submitted to BSE.

Peers
Company Name CMP
Uflex 655.50
EPL 239.45
AGI Greenpac 819.50
Huhtamaki India 243.35
TCPL Packaging 3901.50
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