Mold-Tek Packaging informs about outcome of EGM

03 Feb 2016 Evaluate

Mold-Tek Packaging has informed that the Extra Ordinary General Meeting (EGM) of the Company was held on February 03, 2016.

The above information is a part of company’s filings submitted to BSE.

Mold-tek Packaging Share Price

565.85 13.10 (2.37%)
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Company Name CMP
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