Mold-Tek Packaging fixes record date for interim dividend

10 May 2018 Evaluate

Mold-Tek Packaging has informed that the Company has fixed May 22, 2018 as the Record Date for the purpose of Payment of Interim Dividend.

The above information is a part of company’s filings submitted to BSE.

 

Mold-tek Packaging Share Price

561.10 0.45 (0.08%)
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