Mold-Tek Packaging informs about pledge of shares

03 Dec 2018

With reference to Reg. 31 (1) SEBI (Substantial Acquisition of Shares and Takeover Regulations), 2011 on encumbrance of shares by promoter, Mold-Tek Packaging has informed about submission of the disclosure in Annexure-1 received from A. Seshu Kumari, promoter of company concerning pledge of shares of company.

The above information is a part of company’s filings submitted to BSE.

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