MoneyWorks4Me

Mold-Tek Packaging informs about disclosure

10 Oct 2022 Evaluate

Mold-Tek Packaging has informed that the company has received a ‘Letter of Award’ (‘LOA’) from Grasim Industries - Birla Paints Division, for supply of Packing Material (PAILS) and accordingly, a co-located facility will be set-up by the Company at Panipat to cater to their demands. The new facility is expected to be set up and operational by the end of calendar year 2023 and shall call for an investment of ? 30 crores approximately. The Company also propose to set up Food and FMCG IML container manufacturing facilities in Panipat to capture demand for these products in Northern India.

The above information is a part of company’s filings submitted to BSE.

Peers
Company Name CMP
Uflex 655.50
EPL 239.45
AGI Greenpac 819.50
Huhtamaki India 243.35
TCPL Packaging 3901.50
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