Mold-Tek Packaging informs about disclosure

10 Oct 2022 Evaluate

Mold-Tek Packaging has informed that the company has received a ‘Letter of Award’ (‘LOA’) from Grasim Industries - Birla Paints Division, for supply of Packing Material (PAILS) and accordingly, a co-located facility will be set-up by the Company at Panipat to cater to their demands. The new facility is expected to be set up and operational by the end of calendar year 2023 and shall call for an investment of ? 30 crores approximately. The Company also propose to set up Food and FMCG IML container manufacturing facilities in Panipat to capture demand for these products in Northern India.

The above information is a part of company’s filings submitted to BSE.

Mold-tek Packaging Share Price

583.80 -18.75 (-3.11%)
05-Dec-2025 16:59 View Price Chart
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