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Mold-Tek Packaging submits analyst meet intimation

15 Feb 2023 Evaluate
With reference to Regulation 30(6) read with Para A of Part A of Schedule III of the SEBI (Listing Obligations and Disclosure Requirements), Regulations, 2015 (the ‘Regulations’); Mold-Tek Packaging has informed that it enclosed details of the scheduled meeting with Fund/Broking House/Company/Analysts/Institutional Investors on 15-02-2023.

The above information is a part of company’s filings submitted to BSE.
Peers
Company Name CMP
Uflex 568.65
EPL 216.50
AGI Greenpac 641.70
Huhtamaki India 207.30
TCPL Packaging 4403.95
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