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Raj Packaging Industries board to consider dividend

20 May 2023 Evaluate
Raj Packaging Industries has informed that the meeting of the Board of Directors of Raj Packaging Industries will be held on Saturday, 27.05.2023 at 11:30 AM at the Registered Office of the Company at 6-3-1247, Metro Residency, Flat No. 2020 & 203, Rajbhavan Road, Hyderabad -500082, Telangana to consider payment of dividend, if any, for the Financial Year 2022-23. 

The above information is a part of company’s filings submitted to BSE.
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