Mold-Tek Packaging informs about investors meeting

27 Jun 2023 Evaluate

With reference to Regulation 30(6) read with Para A of Part A of Schedule III of the SEBI (Listing Obligations and Disclosure Requirements), Regulations, 2015 (the ‘Regulations’) and in accordance with the said Regulation(s), Mold-Tek Packaging has informed that 1*1 meeting with Fund/ Broking House/ Company/ Analysts/ Institutional Investors ‘Birla MF’ scheduled on 27.06.2023 through VC/ OAVM.

The above information is a part of company’s filings submitted to BSE.

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