Sansera Engineering’s group company -- MMRFIC Technology (MMRFIC) has opened new R&D facility in Bangalore integrating Semiconductor Packaging, Precision PCB Assembly, and the Testing & Qualification of in-house developed products as a strategic diversification of its product development range.
With an investment outlay of $4 million, MMRFIC's new facility is being developed in phases. The first phase of 14000 sq.ft is operational. It includes an ISO Class 10,000 cleanroom for Semiconductor Packaging that handles die attach, bonding, and sealing. Along with it, a fully automated precision SMD assembly facility is equipped with jet printing pick-and-place machinery, a 10+3 zone oven with nitrogen integration, and other equipment. The operational facility provides for production-scale integration of miniaturized Systems in Packages (SiP) and off-the-shelf Components (COTS).
The new facility also enables the strategic integration of 3D semiconductor packaging, SiP design, PCB design and assembly, functional testing, and supply chain management for comprehensive product development all under one roof. Additionally, it offers failure analysis support for customers worldwide, backed by a dedicated team of engineers across various functions.
Sansera Engineering is an engineering-led integrated manufacturer of complex and critical precision engineered components across automotive and non-automotive sectors.
