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Mold-Tek Packaging informs about earnings call transcript

30 Jul 2026 Evaluate
Pursuant to the Regulation 30 of SEBI (Listing Obligations and Disclosure Requirements), Regulations 2015, Mold-Tek Packaging has enclosed the transcript of the Earnings Conference Call for Investors held on July 27, 2026 to discuss the Q1 FY27 results of the Company.

The above information is a part of company's filings submitted to BSE.

Peers
Company Name CMP
Uflex 568.65
EPL 216.50
AGI Greenpac 641.70
Huhtamaki India 207.30
TCPL Packaging 4403.95
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