Pursuant to Regulation 29 of the SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015 (‘SEBI Listing Regulations’), as amended, Mold-Tek Packaging has informed that, a meeting of the Board of Directors of the Company is scheduled to be held on Wednesday, August 26, 2026, to: 1. consider the proposal for issuance of fully paid Bonus Equity Shares to the existing equity shareholders of the Company. 2. discuss and consider increase in Authorized Share Capital of the Company, subject to approval of shareholders. 3. recommend final dividend, if any, on the equity shares of the Company for the Financial Year ended on March 31, 2026. 4. fix day, date, time and venue for convening the 29th Annual General Meeting of the Company and approval of the draft Notice thereof. 5. fix the Cut-off/Record date for the purpose of sending notice and payment of Final dividend for the Financial Year 2025-26, if declared, at the 29th AGM and e-voting for the said AGM.
The above information is a part of company’s filings submitted to BSE.
